Semiconductor Cleanroom Testing & Certification

GENTAB tests and certifies the ultra-clean environments that semiconductor and microelectronics manufacturing demand. In a fab, a single particle in the wrong place can scrap a wafer, so the controlled environment must perform at the highest cleanliness classifications consistently and verifiably. We provide the measured evidence that your cleanroom holds its class.

Our work spans high-classification airborne particle testing, ULPA and HEPA filter integrity scanning, airflow velocity and uniformity verification across unidirectional flow zones, and precise pressure-differential mapping. At the cleanliness levels semiconductor processes require, airflow uniformity and filtration integrity are decisive — small disturbances in velocity profile or a pinhole in a filter can move a room out of specification. We test with calibrated instrumentation suited to demanding, high-sensitivity environments.

Whether you are commissioning a new fab area, requalifying tool environments after a change, or maintaining recertification across a large facility, we deliver documentation that ties every measurement to acceptance criteria and classification targets. Our whole-system perspective — filtration, airflow, pressurization, and recovery considered together — helps you resolve excursions quickly and keep precision manufacturing environments in a continuous state of control.

High-Classification Particle Testing: Airborne particle measurement and classification for the demanding cleanliness levels semiconductor processes require.

ULPA / HEPA Filter Integrity: Aerosol challenge scanning of high-efficiency filtration to detect leaks that threaten ultra-clean environments.

Airflow Uniformity Verification: Velocity and uniformity testing across unidirectional flow ceilings to confirm stable, protective airflow patterns.

Pressure Differential Mapping: Precise pressure-cascade verification to protect critical tool and process areas from contamination ingress.

Recovery Performance: Recovery and air change testing to confirm rapid return to classification after process or personnel disturbance.

Recertification Programs: Ongoing certification across large fab facilities to keep tool environments continuously qualified.